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International Connector Innovation Forum
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Topics:
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On site photos of the forum
International Connector Innovation Forum
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Forum Date
Apr 15, 2025
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Forum Venue
Room M10 (2nd floor) in Hall W3, SNIEC
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Organizer
Messe Muenchen Shanghai Co., Ltd.


Topics:
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Research on technology integration, innovation and application of connectors in emerging industries (rail transportation, new energy vehicles, 5G communication, public healthcare, etc.)
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Discussion on key materials, key process equipment and testing instruments of connector
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Discussion on chain digital transformation and innovation in connector industry
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Discussion on connector Intelligence and Low Carbon Production
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Display of innovation achievements of regional industrial clusters and enterprise industry chains (enterprises that have been awarded the titles of national and provincial champions and small giants of “specialization and innovation”)
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Time
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Presentation
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Speaker
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9:30-9:45
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Registration
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9:45-10:15
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Connector Design and Manufacturing in the Era of Artificial Intelligence
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Liangjun Xu, Professor, Beijing University of Posts and Communications
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10:15-10:45
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Copper alloy innovation fuels electronic interconnect revolution
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Liu Feng, R&D director, Xingye Alloy Materials Group Co., Ltd.
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10:45-11:15
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Ningbo Jintian Copper (Group) Co.,Ltd.
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11:15-11:45
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Syensqo
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11:45-12:15
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Boway Alloy
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13:00-13:30
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TE
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13:30-14:00
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Amphenol
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14:00-14:30
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JONHON
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14:30-15:00
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Electrical connector solutions for E-mobility
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Chu Hualei, E-mobility Industry Expert, Staubli
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15:00-15:30
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Between milimeters, connection is inifite: Phoenix Contact FINEPITCH board-to-board connector
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Suri Sun, BTB Connector Product Manager, Phoenix Contact China
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15:30-16:00
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ST60 contactless connectivity, opening the "wireless" imagination of the machine era movement
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Danny SHENG, Technical Marketing Manager, China RCD mmW Product Line STMicroelectronics
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16:00-16:30
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Dr. YUNG CHUAN PENG, Secretary General, Taiwan Electronic Connector Association (TECA)
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