Press releases

Today’s R&D engineers not only have to tackle traditional physical connection challenges, but also manage ultra-high-frequency signal transmission, extreme thermal conditions in tight spaces, and operational safety under complex and harsh working environments. The upcoming electronica Shanghai 2026 in Shanghai will serve as a key global platform for showcasing cutting-edge connector technologies and competing technical roadmaps.

With two decades of accumulation, electronica Shanghai has evolved beyond being merely a platform for professional display and efficient networking, becoming a pivotal hub for the deep synergy between global semiconductor giants and local Chinese forces. Amidst the uncertainties of industry development and intense competition, nearly 1,800 exhibitors this year will demonstrate through tangible technology implementation cases that returning to fundamental innovation is the only way to navigate this industry cycle.

As every atom in the physical world seeks its digital twin in cyberspace, 6G emerges as the bridge connecting the physical and virtual realms. Its deployment signals that communication technology has transcended individual device evolution, transforming into a systemic creation that integrates molecular engineering, wave mechanics, and machine intelligence. In this multi-dimensional evolution, the coupling of every precision component and every breakthrough in material processes is laying a solid foundation for the human vision of Intelligent Connection of Everything.

The underlying logic of China's energy storage industry has undergone a fundamental transformation: shifting from policy-driven initiatives to value creation, and evolving from a supporting segment into a pillar industry. Energy storage is elevated from a "cost item" to a "value node," and the vision of a 10-trillion-yuan industry is now transitioning from blueprint to reality.

The path to smart factories is ultimately an engineering practice that goes deep into the physical layer. Software-defined visions such as digital twins and predictive maintenance are entirely built on the ability of underlying hardware to deliver high-fidelity, uninterrupted data streams. From the long-term accuracy of sensors, to signal integrity of connectors in harsh environments, to real-time responsiveness of edge controllers and resilience of power systems, any shortcoming in a physical link will become a bottleneck restricting the upgrading of factory intelligence.

electronica Shanghai 2026 brings together numerous upstream enterprises in the electronics manufacturing sector and will feature a dedicated "Embodied AI Theme Exhibition Area" and an "Embodied Intelligence Industry Application Conference."