International Connector Innovation Forum

Time

Presentation

Speaker

July, 1

AM Session: Research on Connector Basic Generic Technologies, Such as Design, Materials, Processes, Testing, and Standards

Moderator:Liangjun Xu, Professor, Beijing University of Posts and Communications

9:30-9:45

Registration

9:45-10:15

Electrical Connection Technology in the AI Era

Liangjun Xu, Professor, Beijing University of Posts and Telecommunications

10:15-10:45

Intelligent Connectivity & Intelligent Material

Jason Zhang, Director, Technical Marketing Dept.，Ningbo Boway Alloy Material Co., Ltd

10:45-11:15

High-Performance Copper Alloys for Data Interconnects and Thermal Management in the AI Era

Yongman Chen, Senior R&D Manager, Xingye Alloy Materials Group Co., Ltd.

11:15-11:45

The Strategic Importance of Copper Alloy Strips in the Age of Smart Connectivity

Chen Jitian, R&D Manager, Ningbo Jintian Copper (Group) Co., Ltd.

11:45-12:15

New Product Development of Copper Alloys

Chen Xichun, Chairman of the Board , ZHEJIANG METAL MASTER TECHNOLGY CO.,LTD

PM Session: Development Trend of Connector

Moderator: YUNG CHUAN PENG, Secretary General, Taiwan Electronic Connector Association (TECA)

13:30-14:00

Launch of TE Connectivity's New-Generation Safety Connection Technology

Michael Li，Sr Manager，Product Management，TE Connectivity Automotive China

14:00-14:30

Development and Reflections on Onboard High-Speed Interconnection for Commercial Spacecraft

Lance Wang, senior engineer , Guizhou Space Appliance Co.,LTD.

14:30-15:00

Solution for blind plug architecture liquid cooled server fluid connector

Li Junyang, Senior Engineer, JONHON OptronicTechnology Co., Ltd.

15:00-15:30

Practice and Thinking on the 224G High Speed Interconnection System Scheme for Super Nodes

Arthur Chen, Product director, Qinghong electronics（suzhou) co.,ltd.

15:30-16:00

The Current Status and Evolution of Connector Technology for Automotive Intelligent Cabin Seats

Chen Jiayun, Engineering Manager, Connections Systems, Lear Corporation

16:00-16:30

The Connection Revolution under the Wave of Embodied AI

Dr. YUNG CHUAN PENG, Secretary General, Taiwan Electronic Connector Association (TECA)

July, 2

AM Session:Latest Development of Connector Basic Generic Technologies, Such as Design

Michael Zhou, Executive Director of the Materials Center, Shenzhen Connector Industry Association

9:30-10:00

Registration

10:00-10:30

Changes and Opportunities for Connector Raw Materials in the Computing Power Revolution and AI Wave

Michael Zhou, Executive Director of the Materials Center, Shenzhen Connector Industry Association

10:30-11:00

Intelligent-Driven Product Solutions from Xinke

Song Niu, Director of Technology Center, ANHUI XINKE NEW MATERIALS CO.，LTD.

11:00-11:30

Syensqo solutions for AI datacenter connectors

Tina Ge, Marketing Manager, Syensqo

11:30-12:00

Development of Composite Metal Materials and Their Application in the Connector Industry

Qiu Wenting, Senior Engineer, Shenzhen Nonfemet Technology Co., Ltd

PM Session: Development Trend of Connector

Ryan Tan, Secretary-General, TVM Total Value Management Association

13:30-14:00

Intelligent Manufacturing Connection--How AI Is Reshaping a New Paradigm in Connector Manufacturing

Franklin Wu, Engineering Manager, ZF Asia Pacific Automotive Safety Systems (Shanghai) Co., Ltd.

14:00-14:30

Powering the Future: Low-Voltage Connector Innovations & Aptiv System Solutions

Ked Zhao, Product Line Manager, AptivElectrical Centers (Shanghai) Co., Ltd.

14:30-15:00

Get future by speed & efficiency，Efficient Wiring Technologies and Assembly Processes of PCB Connectors

Xin LIU, Product manager, Phoenix Contact China

15:00-15:30

High-speed connecter application in EV

Xinbiao Sun, head of COE team, OEM

15:30-16:00

Application of Advanced Connector Technologies in the NEV Era

Ryan Tan, Secretary-General, TVM Total Value Management Association

The agenda of conference shall be subject to the announcement on that day.