International Connector Innovation Forum
ON THIS PAGE
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International Connector Innovation Forum
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2026 Agenda
International Connector Innovation Forum
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Date
July 1-2, 2026
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Venue
On-site Forum Area in Hall W3（Booth No.W3.659）, SNIEC
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Organizer
Messe Muenchen Shanghai Co., Ltd.
Platinum Sponsor：
Gold Sponsors：
2026 Agenda
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Time
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Presentation
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Speaker
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July,1 9:30-12:15
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AM Session: Research on Connector Basic Generic Technologies, Such as Design, Materials, Processes, Testing, and Standards
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Moderator:Liangjun Xu, Professor, Beijing University of Posts and Communications
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9:30-9:45
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Registration
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9:45-10:15
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Electrical Connection Technology in the AI Era
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Liangjun Xu, Professor, Beijing University of Posts and Telecommunications
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10:15-10:45
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Intelligent Connectivity & Intelligent Material
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Jason Zhang, Director, Technical Marketing Dept.，Ningbo Boway Alloy Material Co., Ltd
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10:45-11:15
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High-Performance Copper Alloys for Data Interconnects and Thermal Management in the AI Era
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Yongman Chen, Senior R&D Manager, Xingye Alloy Materials Group Co., Ltd.
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11:15-11:45
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Material Innovations in the Era of All Time-High Copper Prices: Cost-Saving Strategies for Copper Alloys in Connectors
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Jitian Chen, R&D Manager, Ningbo Jintian Copper (Group) Co., Ltd.
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11:45-12:15
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New Product Development of Copper Alloys
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Qing Ji, President, Zhejiang Metal Master Technology Co.,Ltd
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July 1, 13:00-16:30
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PM Session: Development Trend of Connector
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Moderator: YUNG CHUAN PENG, Secretary General, Taiwan Electronic Connector Association (TECA)
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13:00-13:30
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TBD
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13:30-14:00
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TBD
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14:00-14:30
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TBD
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14:30-15:00
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TBD
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15:00-15:30
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TBD
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15:30-16:00
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TBD
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16:00-16:30
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TBD
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July,2 9:30-12:00
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AM Session: Research on Connector Basic Generic Technologies, Such as Design, Materials, Processes, Testing, and Standards
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Michael Zhou, Executive Director of the Materials Center, Shenzhen Connector Industry Association
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9:30-9:45
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Registration
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10:00-10:30
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Changes and Opportunities for Connector Raw Materials in the Computing Power Revolution and AI Wave
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Michael Zhou, Executive Director of the Materials Center, Shenzhen Connector Industry Association
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10:30-11:00
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Copper alloy strip for high-end connectors
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Song Niu, Engineer, Anhui Xinke New Materials Co., Ltd.
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11:00-11:30
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TBD
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11:30-12:00
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TBD
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July,2 13:30-16:30
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PM Session: Development Trend of Connector
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Ryan Tan, Secretary-General, TVM Total Value Management Association
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13:30-14:00
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TBD
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14:00-14:30
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TBD
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14:30-15:00
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TBD
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15:00-15:30
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TBD
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15:30-16:00
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TBD
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16:00-16:30
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TBD
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The agenda of conference shall be subject to the announcement on that day.
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