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  • 2026 International Automotive Electronics Technology Innovation Forum

  • 2026 Agenda

2026 International Automotive Electronics Technology Innovation Forum

  • Date

    July 1-2 , 2026

  • Venue

    Room M42 (2nd floor) in Hall N1, SNIEC

  • Organizer

    Shanghai Transportation Electronics Association

    Shanghai Pudong Automotive Electronics Innovation and Intelligent Industry Alliance 

    Messe Muenchen Shanghai Co., Ltd.

    白金赞助:

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    黄金赞助:

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2026 Agenda

    • Time

    • Presentation

    • Speaker

    • July, 1

    • Session:  Intelligent Cockpit

    • Moderator: Jared Yang, Director of Technology Strategy, Great Wall Motor R&D Centre

    • 9:00-9:45

    • Registration

    • 9:45-10:15

    • Software-hardware-cloud integration: an AI-native architecture redefines the smart cockpit experience.



    • Tang Yan, R&D Director, PATEO CONNECT Technology (Shanghai) Corporation

    • 10:15-10:45

    • Distributed audio solution based on zonal architecture



    • Bei Wei HE, Application Engineer, STMicroelectronics

    • 10:45-11:15

    • Core Bridge · New Ecosystem: DIA36600 Ushers in a New Era of Automotive-Grade eUSB2 Repeater

    • Leon Zhuang. High power product BU VP, Dioo Microcircuits Co., Ltd. Jiangsu

    • 11:15-11:45

    • Application of Semiconductor Discrete Devices in Automotive Smart Cockpits

    • Will Zhu, Associate Director of Automotive Electronics Marketing, Yangzhou Yangjie Electronic Technology Co., Ltd.

    • 11:45-12:15

    • Panoramic Vision, Interaction Redefined —Value Ascension of Large-Format AR-HUD

    • Pin Liang, General Manager of HUD Business Unit,Shanghai Puchuang Auto Technology Co.,Ltd.

    • 12:15-13:15

    • Lunch Break

    • 13:15-13:45

    • Driving Efficiency: Next-Generation Low-Voltage Power Management Trends & Aptiv Solutions

    • Yang Runjie, Power Management Product Line Manager, Aptiv Electrical Centers (Shanghai) Co., Ltd.

    • 13:45-14:15

    • The Intelligence Hiding at the Edge—A Preview

    • Henri-Xavier Delecourt, onsemi AMG ethernet expert

    • 14:15-14:45

    • AI Agent-Driven Handling of Cybersecurity Risks in Connected Cockpits

    • Tagg Sun, BU Director, Shanghai UniSentry Intelligent Technology Co., LTD

    • 14:45-15:15

    • Sunlord Electronics: Innovation & Transformation Empowering Intelligent Cockpits

    • Eric Wu, General Manager of Xiamen Branch, Shenzhen Sunlord Electronics Co.,Ltd.

    • 15:15-15:45

    • NXP S32K5 MCU Family Empower the SDV Zonal Architectures

    • Vincent Deng, Lead of NXP SDV and Edge AI Marketing and BD, Great China, NXP

    • 15:45-16:15

    • Nexperia: Building a reliable foundation for the smart cockpit

    • Edward Zhang, Senior FAE manager, Nexperia Semiconductors (China) Ltd.

    • 16:15-16:45

    • Huaqin Galaxy: A Cross-Category Ecosystem Approach to Human-Cabin-Environment AI Experience

    • Eric AN, Product Strategy Director, Huaqin Technology Co., Ltd.

    • July, 2

    • AM Session: Autonomous Driving

    • Moderator: Nan Lv, Global Sales & Marketing VP, KOTEI CEO, KOTEl Germany

    • 9:30-10:00

    • Registration

    • 10:00-10:30

    • The Impact of the Agent Paradigm on Autonomous Driving R&D

    • WEI YIN, oftware Director, Intelligent Driving Center, IMMOTORS

    • 10:30-11:00

    • Infineon Automotive Raw-Satellite Radar Solution Introduction

    • Nigel Wang, Senior Marketing Manager of Infineon Technologies Automotive in Greater China

    • 11:00-11:30

    • AI in Automotive Chip Failure Analysis

    • Linhua Zhang, Technical Director, Wintech Nano (Suzhou) Co., Ltd

    • 11:30-12:00

    • Automotive-grade SE + NFC: One security chip, one digital key, one tap for full connectivity.

    • Haiming Huang, Technical Marketing Engineer, Shanghai Fudan Microelectronics Group Co., Ltd.

    • PM Session: Autonomous Driving

    • Moderator: Wancheng Lu, Director of the Expert Committee,SPAEIA, Former Deputy Chief Engineer, UAES

    • 13:15-13:45

    • High-performance Millimeter-wave Radar Empowers Safe Driving

    • Leo Li, Director, Shanghai Baolong Automotive Corporation

    • 13:45-14:15

    • Architecting Trusted Intelligent Mobility Together

    • Mieu Ngan Pang,Senior Director,Ecosystem Strategy and Marketing,Automotive,ADI

    • 14:15-14:45

    • Renesas Enhances Cross-domain Integration and Centralized Computing

    • Wei Du, Product Marketing Specialist, Renesas Electronics

    • 14:45-15:15

    • Future-Proof Automotive High-Voltage-to-SELV Conversion Using Sine Amplitude Converter (SAC™) Technology



    • Mao Min, Senior FAE, Vicor

    • 15:15-15:45

    • Bosch MEMS Sensor, Wide Offerings to ADAS

    • Kan Wang, Product Manager, Bosch(China) Investment Ltd.

    • 15:45-16:15

    • Sharing and Reflections on Automotive Intelligence Platforms

    • Dr. Wu, Qingwen, Senior Director, Keboda Technology Co.,Ltd.

    • The agenda of conference shall be subject to the announcement on that day.

electronica Shanghai 2026

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