International Embedded System Innovation Forum
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International Embedded System Innovation Forum
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Topics:
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Review of the 2025 Forum Agenda
International Embedded System Innovation Forum
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Date
July 1, 2026
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Venue
On-site Forum Area in Hall N3（Booth No. N3.379）, SNIEC
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Organizer
Messe Muenchen Shanghai Co., Ltd.
co-organizer:Embedded System Association
Topics:
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Morning Session: Embedded AI Technology and Applications
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——Endpoint AI technology trends, RISC-V + AI, powerful SoC chip for AI , LLM edge computing platforms, and AI applications such as Machine vision and Embodied intelligence.
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Afternoon Session: Industrial Internet of Things Technology and Ecosystem
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——Multi-axis Motor control and drive ，IoT AI agent, Industrial Ethernet , A new wireless network and MCU industry IoT ecosystem.
Review of the 2025 Forum Agenda
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Time
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Presentation
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Speaker
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9:30-12:00
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AM Session: Embedded AI Technology and Applications
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Moderator: ALLAN HE, Secretary in Chief, Embedded System Associations
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9:30-10:00
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Registration
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10:00-10:30
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Intelligent Embedded System Development and Practice
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Bi Sheng, Associate Professor, South China University of Technology
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10:30-11:00
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Arm Edge AI Enable IoT Future
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Jacy Fan, Senior Marketing Manager of Embedded&IoT LoB, Arm
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11:00-11:30
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STM32N6: Empowering Edge AI with 'Core' Innovation
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Lisa Ding, Marketing Manager, ST China Microcontroller & Digital ICs Group, STMicroelectronics
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11:30-12:00
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Technology and Applications of Intelligent Operating Systems for Industrial Robots
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Qingfeng Li, Deputy Director, Hangzhou Innovation Institute of Beihang University
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13:00-16:00
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PM Session: Industrial Internet of Things Technology and Ecosystem
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Moderator: Teng Huaqiang, Professor level senior engineer, Shanghai Instrument Research Institute
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13:00-13:30
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Efficient AI through Approximation
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Dr. Siting Liu, Researcher. ShanghaiTech University
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13:30-14:00
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Optimize R&D & Speed Time-to-Market with Leading-Edge Instrumentation Solutions
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Steven Jiang, Senior Marketing Manager, ADI Instrumentation System Solutions Unit
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14:00-14:30
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Thinking in AI - Using Renesas AI Product
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Andrew SU, Product Marketing Specialist, Renesas Electronics Corporation
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14:30-15:00
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Agile Development Approach for RISC-V Edge-Side AI Processors Targeting Local Deployment
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Zeng Yi, Founder & CEO, WingSemi Technology Co., Ltd.
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15:00-15:30
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RISC-V Core, Smart Future—— Next-Gen Solutions for Industrial Control & Smart Appliances
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Daniel Wang，CEO，ArtInChip
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15:30-16:00
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Embedded Virtualization Techniques and Trends for Industrial System
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ALLAN HE, Secretary in Chief, Embedded System Associations
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The agenda of conference shall be subject to the announcement on that day.
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