International Connector Innovation Forum (free of charge)
General Information
- Date: July 3, 2020
- Venue: On-site Forum Area A, in Hall 6.2, NECC
- Organizer: Messe München
- Scale: 450+
Topics
- Connector Industry Reliability System Engineering Application Model (Failure Analysis, Test Verification, Quantitative Design, Failure Prevention)
- Military and Civilian Integration Applications and Innovative Development of Connector Products (High Current, High Voltage, Heat Resistance, Flame Retardant, High Density, Miniaturization, High Speed Transmission and Environmental Resistance)
- Innovative Development of Intelligent Manufacturing in Connector Industry (Big Data, Artificial Intelligence, Intelligent Production Assembly, Intelligent Online Detection, Internet Technology Services, Smart Logistics, etc.)
- Integrated Innovation and Application Research of Connectors in Rail Transit, New Energy Vehicles, etc.
- Innovative Development and Market Dynamic Analysis of Connectors for 5G Mobile Communication Equipment
- The Development Opportunities and Challenges Brought by the 5G Smart Era to the Connector Industry
- The Latest Development of Connector Basic Generic Technologies, Such as Design, Materials, Process, Testing, etc.
2019 Audience Analysis
2019 Partial Audience Sample List
BYD · NIO · Yutong Bus · AIWAYS · SAIC · CRRC Times · Shaanxi Heavy Vehicle ·
Hanteng Automobile · Tianhai Automotive Electronics · APTIV · Yanfeng Visteon ·
Hua Wei · vivo · Samsung · Fiberhome · HBC Technologies · Yazaki · Hikvision
Previous Review
Photos
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The Latest Development of Connector Basic Generic Technologies, Such as Design, Materials, Process, Testing, etc.
Host： Prof. Liangjun Xu Beijing University of Posts and Telecommunications PHD supervisor
| Time | Topic | Guest |
|---|---|---|
| Time | TopicHigh Conductivity Copper Alloy |
Guest
Yongli Chen |
| Time | TopicHow does engineering plastic enable electrification of vehicles |
Guest
Yu Bin |
| Time | TopicThe Introduction of Special coating type & HPAs |
Guest
Dr. Tony Gan |
| Time | TopicHigh Performance Copper Alloy -- Rolled Products |
Guest
Jason Zhang |
| Time | Topic |
Guest
Prof. Liangjun Xu |
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Development Trend of Connector
Host： Lawrence Mo Tier 1 Component Supplier Regional EMC Expert
| Time | Topic | Guest |
|---|---|---|
| Time | TopicDiscussion on the development of high speed interconnection technolog |
Guest
Zhou Guoqi |
| Time | TopicODU Turntac technology |
Guest
Alex Shen |
| Time | TopicODU solution in data transmission |
Guest
Lily Zhou |
| Time | TopicMulti-Gig Channel --Vehicle Ethernet |
Guest
Iris Luo Jallen Zhang |
| Time | TopicApplication-Specified Connectivity Solution in Digital Era |
Guest
YumingSong |
| Time | TopicIntegrated innovation and application of connector technology in rail transit |
Guest
Wei Li |
| Time | TopicEMC Design and Simulation of Connector Interface Circuits for Automotive Electronic Components |
Guest
Lawrence Mo |
