International Connector Innovation Forum (free of charge)

On-site Forum in Hall 6.2, National Exhibition and Convention Center(Shanghai)

General Information

  • Date: July 3, 2020 
  • Venue: On-site Forum  Area A, in Hall 6.2, NECC
  • Organizer: Messe München
  • Scale: 450+

Topics

  • Connector Industry Reliability System Engineering Application Model (Failure Analysis, Test Verification, Quantitative Design, Failure Prevention)
  • Military and Civilian Integration Applications and Innovative Development of Connector Products (High Current, High Voltage, Heat Resistance, Flame Retardant, High Density, Miniaturization, High Speed Transmission and Environmental Resistance)
  • Innovative Development of Intelligent Manufacturing in Connector Industry (Big Data, Artificial Intelligence, Intelligent Production Assembly, Intelligent Online Detection, Internet Technology Services, Smart Logistics, etc.)
  • Integrated Innovation and Application Research of Connectors in Rail Transit, New Energy Vehicles, etc.
  • Innovative Development and Market Dynamic Analysis of Connectors for 5G Mobile Communication Equipment
  • The Development Opportunities and Challenges Brought by the 5G Smart Era to the Connector Industry
  • The Latest Development of Connector Basic Generic Technologies, Such as Design, Materials, Process, Testing, etc.

2019 Audience Analysis


2019  Partial Audience Sample List

BYD · NIO · Yutong Bus · AIWAYS · SAIC · CRRC Times · Shaanxi Heavy Vehicle ·

Hanteng Automobile · Tianhai Automotive Electronics · APTIV · Yanfeng Visteon ·

Hua Wei · vivo · Samsung · Fiberhome · HBC Technologies · Yazaki · Hikvision


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  • The Latest Development of Connector Basic Generic Technologies, Such as Design, Materials, Process, Testing, etc.

    Host: Prof. Liangjun Xu Beijing University of Posts and Telecommunications PHD supervisor
Time Topic Guest
Time TopicTBD Guest

TBD

Time TopicHow does engineering plastic enable electrification of vehicles Guest

Yu Bin
DSM Engineering Materials DSM Engineering Materials

Time TopicThe Introduction of Special coating type & HPAs Guest

Dr. Tony Gan
KMD Prescise Copper Alloy (Henan) Co., Ltd. Technical & Marketing manager

Time TopicTBD Guest

TBD

Time Topic Guest

Prof. Liangjun Xu
Beijing University of Posts and Telecommunications PHD supervisor

  • Development Trend of Connector

    Host: Lawrence Mo Tier 1 Component Supplier Regional EMC Expert
Time Topic Guest
Time TopicDiscussion on the development of high speed interconnection technolog Guest

Zhou Guoqi
JONHON Engineer

Time TopicTBD Guest

TBD
ODU.

Time TopicTBD Guest

TBD

Time TopicApplication-Specified Connectivity Solution in Digital Era Guest

YumingSong
Beijing JingbeiComponents Co. ltd Chief Scientist Advisor

Time TopicIntegrated innovation and application of connector technology in rail transit Guest

Wei Li
Zhejiang Yonggui Electric Equipment Co., Ltd Engineer

Time TopicEMC Design and Simulation of Connector Interface Circuits for Automotive Electronic Components Guest

Lawrence Mo
Regional EMC Expert Tier 1 Component Supplier

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