International Embedded Systems Innovation Forum (free of charge)

Shanghai New International Expo Center(SNIEC)

General Information

Date:April 15, 2021

Venue: On-site Forum  Area , in Hall 5.2, NECC

Organizer: Messe Muenchen Shanghai Co., Ltd.

Scale:250+


Topics 

  • Embedded AI: AI Chip, FPGA and Storage ,Development and application of RISC-V
  • Internet of Things: IoT Security, IIOT, Internet of Vehicles and IoT Ecosystem of MCU

2020 Audience Analysis

Attendance audience: 284


Previous Review


2020  Partial Audience Sample List

Geely Automobile Research Institute

ZOEMO Vehicle

Yanfeng Visteon Automotive Electronics Co., Ltd. Chongqing Yanfeng Adient Auto Parts System Co., Ltd.

Shanghai Nuen Automotive Technology Co., Ltd.

Schaeffler China Co., Ltd.

China Railway Shanghai Design Institute Group Co., Ltd.

China Mobile Communications Group Co.,Ltd

HuaWei Technologies Co., Ltd.

Zhongxing Telecommunication Equipment Corporation

Shanghai Mexon Communication Technology Co., Ltd.

Shanghai Donghan Communication Technology Co., Ltd.

Shanghai United Imaging Healthcare

Agilent Technologies (China) Co., Ltd.

Shanghai Lifu Medical Equipment Co., Ltd.

Autobio Co., Ltd.

Panasonic Electric (Beijing) Co., Ltd.

Gree Electric Co., Ltd.

Aike Robot Co., Ltd.

Suzhou Collaborative Innovation Robot Research Institute

Amazon

Shanghai Aerospace Guohe Technology Development Co., Ltd.

China Air-to-Air Missile Research Institute


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