International Embedded Systems Innovation Forum (free of charge)
General Information
Date：April 15, 2021
Venue: On-site Forum Area , in Hall 5.2, NECC
Organizer: Messe Muenchen Shanghai Co., Ltd.
Scale:250+
Topics
- Embedded AI: AI Chip, FPGA and Storage ，Development and application of RISC-V
- Internet of Things: IoT Security, IIOT, Internet of Vehicles and IoT Ecosystem of MCU
2020 Audience Analysis
Attendance audience: 284
Previous Review
2020 Partial Audience Sample List
Geely Automobile Research Institute
ZOEMO Vehicle
Yanfeng Visteon Automotive Electronics Co., Ltd. Chongqing Yanfeng Adient Auto Parts System Co., Ltd.
Shanghai Nuen Automotive Technology Co., Ltd.
Schaeffler China Co., Ltd.
China Railway Shanghai Design Institute Group Co., Ltd.
China Mobile Communications Group Co.,Ltd
HuaWei Technologies Co., Ltd.
Zhongxing Telecommunication Equipment Corporation
Shanghai Mexon Communication Technology Co., Ltd.
Shanghai Donghan Communication Technology Co., Ltd.
Shanghai United Imaging Healthcare
Agilent Technologies (China) Co., Ltd.
Shanghai Lifu Medical Equipment Co., Ltd.
Autobio Co., Ltd.
Panasonic Electric (Beijing) Co., Ltd.
Gree Electric Co., Ltd.
Aike Robot Co., Ltd.
Suzhou Collaborative Innovation Robot Research Institute
Amazon
Shanghai Aerospace Guohe Technology Development Co., Ltd.
China Air-to-Air Missile Research Institute
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