Wafer-Level Chip Scale Package (WLCSP) is one of the most cost-effective

and space-efficient packaging options,The die size of Puya products has leading competitiveness, so Puya WLCSP is a true chip-scale package.Puya provides WLCSP SPI NOR Flash, IIC EEPROM & VCM Driver products for mobile or portable form factor applications, such as 3D-CCM,digital cameras,smart watches,GPS navigation devices ,etc