2023Exhibitor List
| Booth No. | Company Name | Country |
|---|---|---|
| 7.2D110 | NISSHINBO Micro Devices Inc. | Japan |
| 5.2C116 | Guangdong Fenghua Advanced Technology Holding Co., Ltd. | China (including Hong Kong, Macau and Taiwan) |
| 6.2D336 | Rutronik Electronics Asia HK Ltd | Germany |
| 5.2B132 | Sanyou Corporation Limited | China (including Hong Kong, Macau and Taiwan) |
| 6.2E106 | Shenzhen Easybuy IC Electronics Co.,Ltd | China (including Hong Kong, Macau and Taiwan) |
| 4.1C240 | Henan Fangyi Sealing Technology Co., LTD | China (including Hong Kong, Macau and Taiwan) |
| 6.2B110 | Suzhou Etron Electroncis Co., Ltd. | China (including Hong Kong, Macau and Taiwan) |
| 5.2A228 | Bourns trading (Shanghai) Co., Ltd | |
| 7.2C510 | Suzhou Lieqi Intelligent Equipment Co.,Ltd | China (including Hong Kong, Macau and Taiwan) |
| 5.2A524 | JIANGSU FALA ELECTRONICS CO., LTD | China (including Hong Kong, Macau and Taiwan) |
| 5.2B120 | Changzhou Jiarong Electronic Co., Ltd | |
| 5.2B116 | Prosemi Microelectronics Technology (Suzhou) Co., Ltd | China (including Hong Kong, Macau and Taiwan) |
| 7.2D102 | GigaDevice Semiconductor Inc. | China (including Hong Kong, Macau and Taiwan) |
| 7.2D116 | Dosilicon Co,Ltd | China (including Hong Kong, Macau and Taiwan) |
| 5.2C210 | VACUUMSCHMELZE GmbH & Co. KG | Germany |
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