International Embedded System Innovation Forum
Agenda
General Information
Date：12 July, 2023
Venue: On-site Forum Area C in Hall 5.2 near Gate 9, NECC
Organizer: Messe Muenchen Shanghai Co., Ltd.
Scale:250+
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Gold Sponsor
Topics
- Embedded AI: Edge computing and device intelligences , Framework for Machine Learning and software tool, FPGA and Storage, Development and AIOT application of RISC-V
- Internet of Things: IoTSecurity and solution, IIOT and Smart Manufacturing, Internet of Vehicles and IoTEcosystem of MCU
2021 Audience Analysis
Attendance audience: 303
2021 Partial Audience Sample List
Previous Review
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